IBM Designed Powerbased Chip for Microsoft Xbox 360

Source: www.physorg.com
Topic: Xbox 360

Short Desciption:
Microsoft Xbox 360. At Fall Processor Forum in San Jose California today IBM announced the custom designed. microprocessor built for Microsoft's Xbox 360 ...

 

Content Inside:
IBM Designed Powerbased Chip for Microsoft Xbox 360Page 1IBM Designed Powerbased Chip forMicrosoft Xbox 360At Fall Processor Forum in San Jose California today IBM announced the custom designedmicroprocessor built for Microsoft's Xbox 360 console is in production at the company's EastFishkill N.Y. fab and at Chartered Semiconductor Manufacturing in Singapore. Together IBM and Chartered's common platform offers Microsoft a unique dualsource capability thatprovides the highest level of manufacturing redundancy and flexibility.The specialized chip featuring customized and enhanced IBM intellectual property was designed anddeveloped by IBM and Microsoft to meet the unique requirements of the next generation Xbox 360console. "The Xbox 360 chip set was designed from the ground up specifically for highdefinition gaming andentertainment" said Todd Holmdahl corporate vice president hardware for Xbox. "Working with IBMgave us the flexibility to design a processor to give game developers the kind of targeted power they needto make great games." "Microsoft's aggressive timetable required that IBM take the Xbox 360 chip design from concept to fullexecution in just 24 months" said Ilan Spillinger IBM Distinguished Engineer and director of the IBMDesign Center for Xbox 360.IBM engineers have been working with Microsoft to develop the chip since 2003 at IBM locationsincluding Rochester Minnesota; Austin Texas; and Raleigh North Carolina. Microsoft plans to formallylaunch Xbox 360 simultaneously in the United States Japan and Europe later this year. The chip features a customized version of IBM's industry leading 64bit PowerPC core. The chip includesthree of these cores each with two simultaneous threads and clock speeds greater than 3 GHz. It features165 million transistors and is fabricated using IBM's 90 nanometer Silicon on Insulator (SOI) technology toreduce heat and improve performance. The chip's innovative 21.6 GB/s Front Side Bus (FSB) Architec ...

 

 

 

 

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